Premolded cavity qfn package from global chip materials. The quad flat nolead qfn package has been used widely since its introduction in 1998. Qfn package dimensions and tolerances, refer to the packaging specification ds00000049. Drmos soldering guidelines recommendations for printed. When the qfn package design needs to start the assembly house will ask you for a few documents. Design guidelines for cypress quad flat nolead qfn packaged. The vq100 package has the easiest layout and uses very common, lowcost pcb dimensions, as shown in table 6. Board layout and stencil information for most texas instruments ti quad flat. Good design rules and assembly processes will result in high soldering yields. They will help you prepare your classes for use in packages. Because the qfn platform represents the latest in surface mount packaging technology, it is important that the design of the printed circuit board pcb, as well as the assembly process, follows the suggested guidelines outlined in this document. High temperature cofired ceramic htcc package design and. The bond diagram shows an example for a 16 pin qfn. Qfn package design played a critical role in voiding formation of the solder joint.
The qfn dimensions used in the land pattern design. Open cavity qfn package global chip materials manufactures premolded open cavity qfn packages in standard jedec body sizes and lead counts. This package can be easily mounted using standard pcb assembly techniques and can be removed and replaced using standard repair procedures. The book is really split into three major portions although there are six chapters. Simulation results and model validated against measured data to 40. Refer to published reports, books, papers 410 for this category of. If a qfn package with an lti feature is used, a solder joint fillet at the side wall of the qfn land is enabled, because an lti feature provides a partly plated and therefore wettable side wall at. The first portion talks about the history, art and science of package design. Once your client has approved the final design, send them all of the design files.
Cypress qfnpackaged devices offer a near chipsized footprint with a high io count compared with standard leaded ic packages, such as small. Two different package configurations were used, so as to have different types of side terminations. Intersils quad flat no lead qfn package family offering is a relatively. The layout recommendations for the cc256x qfn device described in this document are based on two routable layers and two solid ground layers layer 2 and layer 4. In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch jan 01, 2008 theres a lot that goes behind package design. Board level reliability and assembly process of advanced qfn. Qfnquad flat noleaddfn dual flat nolead is a near cspchip size packageplastic encapsulated package using conventional copper leadframe technology.
Qfn package technology is ideal for power conversion devices due to the solderable exposed bottom copper leadframe for thermal dissipation and the resulting low package thermal resistance, the smaller package footprint and thickness, large lead size and pitch, and excellent lead coplanarity. Qfn packages avoid routing between the flag and the pads of a qfn device, as shown in figure 4 below. Land pad and exposed pad design is the key to boardlevel reliability, and texas instruments strongly recommends following the design rules included in the application note. Some key qfn design considerations are pad and stencil design. This book is a quick reference and primer on package design and the principles that make design projects successful. Experimentation with qfn packages of similar size has shown that these packages. The land pattern design for all qfn type packages is based on the ipc7093 and ipc7351 standards. This is because of its low cost, compared to other package types. Quikpak s exclusive openmolded plastic package ompp is a premolded, air cavity qfn package quad flat nolead designed to provide a high quality, fast solution for your ic packaging and ic assembly needs. Pcb design and rework, package performance information such as mo isture sensitivity level msl rating, board level reliability, mechanical, and thermal resistance data are also included for reference.
In the first part youll revisit the solid principles of class design. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as well as major military and aerospace institutions. Ansys hfss 3d simulation data was used to create model. Pcb design perfection starts in the cad library part 15 qfn.
The computeraided design cad files and all associated content posted to this website are created, uploaded, managed and owned by third party users. In principles of package design matthias noback tells you everything about designing software components, also known as packages. The qfn is a leadless package where electrical contact to the pcb is made by soldering the leads on the bottom surface of the package to the pcb, instead of. What size land pad should i design on my board for these packages. Qfn is a lead framebased package which is also called csp chip scale package with the ability to view and contact leads after assembly. Examples of large size qfn and son package types nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. Assembly guidelines for qfn quad flat nolead and son. An2265 assembly guidelines for land grid array lga.
If pin pitch and body width are the same youre on the right track but this is never a guarantee. The cadence allegro environment offers complete and scalable technology for the design and implementation of pcbs, packages, and systemsinpackage sips. Circuits assembly online magazine lgaqfn solderability. Nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. Lgaqfn solderability can be a challenge, and with an increasing number of components produced in this format, care needs to be taken to find a suitable test method. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as. Even if the device ds doesnt give you land patterns, you should be able to tell by comparing the pad sizes between two similar parts. Offering low price, excellent performance and small size, it is an ideal package for many applications. The package structure conducts a costeffective packaging solution that benefits to minimize package size as well as enhances thermal and electrical performance over the traditional leaded. Pcb layout recommendations for leaded packages vq100 quadflat package for applications that require 72 pio pins or less and where board space is not the primary concern, the vq100 package is the best option. Make sure all files are saved in the cmyk color mode and 300dpi resolution.
The data showed that dual row qfn resulted in more voiding than the single row qfn component. Air cavity qfn packages openmolded plastic packages ompp quikpaks exclusive openmolded plastic package ompp is a premolded, air cavity qfn package quad flat nolead designed to provide a high quality, fast solution for your ic packaging and ic assembly needs. Pcb land pattern design and surface mount guidelines for. Routing and vias between the flag and the pads can easily be shorted to either the flag or to the pads because of the physical dynamics of the solder under the device. Here in komex we found a way to inspect qfns since we dont have any xray machine in line to verify the well soldering. This book breaks down the process of design in a much more comprehensive way than most books on the subject, which. The mapmolded, sawn type is the standard for nxps packages. Similar qfn type, but different package design, would result in different voiding level, as shown in the case of qfn2 and qfn156 figure 16. Section view of a qfn package sloa122 july 2006 qfn layout guidelines 1 submit documentation. Jan 21, 20 qfn package is probably the most successful package type today. Package dimensions dfn10, qfn24, qfn28, cqfn32, qfn48 release b2, page 33 mm min. Quikpak, originally founded in 1994 as spt, was purchased by delphon industries in 2000. The second part covers the important, yet lesser known package design principles.
Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn. Flat noleads, also known as micro leadframe mlf and son smalloutline no leads, is a surfacemount technology, one of several package technologies that connect ics to the surfaces of pcbs without throughholes. The quad flat nolead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. Htcc design possibilities package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density. Body of knowledge bok for leadless quad flat noleadbottom. Qfn quad flat noleaddfn dual flat nolead is a near cspchip size package plastic encapsulated package using conventional copper leadframe technology. The dualrow or multirow qfn package utilizes an interstitial lead design that. Tn1257 pcb layout recommendations for qfn packages. Package design workbook explains all the ins and outs of packaging design in depth. Ic packaging design and modeling ic packaging complexity levels are rising yearbyyear in lock step with process advances and electrical performance enhancements. The quad flat pack no leads qfn style of leadless packaging is becoming ever more used for many applications in printed circuit board assembly. Qfn quadflat noleads is a plastic smt package consisting of. For more information about qfn package use, see eb806. This document describes the printed wiring board design and the pcba guidelines.
Reproduction of information in ti data books or data sheets is permissible only. Package mounting guide qfn toshiba electronic devices. A significant effect on mounting the qfn package on the board and the quality of. Cadence ic package design technology ic packaging is now a critical link in the siliconpackageboard design flow. The free e book for packaging and graphic designers containing a collection of editable retail packaging dielines that are ready to download, design, and share. Design guidelines for cypress quad flat nolead qfn. Pcb land pattern guidelines the qfndfn is a surface mountable package with bottom termination of its external connections pins. Reproduction of ti information in ti data books or data sheets is permissible only if. The 6mil line and spacing design rules for leadframe mlfqfn dictates a wide pitch of 12 mils.
Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn physically and electrically connect integrated circuits to printed circuit boards. The major features a of the final package design are listed in table 1. Qfn 5532050x 5 mm package model description the pkgbaiqfn5532001 is a simulation based equivalent circuit model of barry industries pn qfn 5532050x molded 5 mm quad flat no lead qfn surface mount package. Qfn package style is relatively new, such industry guidelines for it. Package design workbook addresses all aspects of the creative process including choosing a package format, colors and materials, final finishes, and special considerations such as awkward objects and unique display considerations. Ipc7526 stencil and misprinted board cleaning hand book. Electrical connection recommendations for the exposed pad on qfn and dfn packages. And8086d board mounting notes for quad flatpack nolead. The qfn can have a single or a multiple rows of pins.
In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch package classifications 14 3 special packages package symbol type package types old new pin count cob chip on board ks ka custom design tcp tape carrier package avz va custom design memory module socket type ys bs ds ya yb yc yd ye special packages cot chip on tape d r a c c i c k. Two types of rigid laminate construction were used. Design guidelines for cypress quad flat nolead qfn packaged devices. Examples of small size qfn and son package types figure 2. While dr qfn packages share common characteristics with conventional qfns in terms of design, performance and reliability12 3, surface mounting stands out as a major challenge in the package.
And8086d board mounting notes for quad flatpack no. The quad flat nolead qfn package is a csp plastic encapsulated package with a copper lead frame substrate. This style of package was selected for investigation. Each cad and any associated text, image or data is in no way sponsored by or affiliated with any company, organization or realworld item, product, or good it may purport to portray. Qfn package is probably the most successful package type today.
Qfn package could be used in a variety of applications. Cell phones, pdas, portable music and video players can significantly benefit from this package. Designing product packaging logos, web, graphic design. In my experience qfn and tqfn are pretty similar for example that program doesnt list tqfn, only qfn. Applications requiring low standoff heights, improved thermal performance, reduced size or reduced weight are good candidates for qfn designin. Bottom terminated components and quad flat nolead btcqfn packages have been.251 26 788 431 640 864 537 252 736 729 1427 1199 644 1103 192 1451 851 243 813 912 770 322 996 63 155 1155 238 1468